Substrate processing method and substrate processing apparatus,申请号US20020154927-传众专利搜索

Substrate processing method and substrate processing apparatus

申请公布号：US2002139302(A1)

申请号：US20020154927

申请日期：2002.05.28

申请公布日期：2002.10.03

申请人：

NAGASHIMA SHINJI

发明人：NAGASHIMA SHINJI

分类号：H01L21/00;(IPC1-7):B23P17/00;B21D39/03

主分类号：H01L21/00

摘要：In a hot plate for performing heat processing while an inert gas is supplied, a mounting table is provided with a groove and a lower end portion of a lid body can be inserted into the groove. The lid body is lowered in two steps by a lid body drive apparatus. The lid body forms a processing chamber between the lid body and the mounting table by the lowering of the first step, and the lower end portion of the lid body is inserted into the groove by the lowering of the second step, thereby reducing the processing chamber in capacity. Consequently, in a substrate processing apparatus which requires a supply of gas, it becomes possible to reduce the capacity of the processing chamber and to reduce the required amount of gas.