Surface acoustic wave device and manufacturing method thereof,申请号US20020066642-传众专利搜索

Surface acoustic wave device and manufacturing method thereof

申请公布号：US2002135269(A1)

申请号：US20020066642

申请日期：2002.02.06

申请公布日期：2002.09.26

申请人：

SEIKO EPSON CORPORATION

发明人：KINOSHITA YUSUKE

分类号：H03B5/30;H03H3/08;H03H9/05;H03H9/10;H03H9/25;(IPC1-7):H03H9/25

主分类号：H03B5/30

摘要：The invention provides a surface acoustic wave device and a manufacturing method thereof which enhances reliability and yield. A surface acoustic wave device having a surface acoustic wave element and an electronic component that drive controls the surface acoustic wave element is provided with a first substrate, which has a first connecting terminal having a first hollow component formed therewith including an opening that accommodates an electronic component and electrically connecting to the electronic component formed in the first hollow component, and a second connecting terminal formed in the vicinity of the opening and electrically connecting to the first connecting terminal, a second substrate where one face side is joined to the opening of the first substrate and the surface acoustic wave element is electrically connected to the second connecting terminal on the other face side, and a cap which is joined to the first substrate and has a second hollow component that hermetically seals the surface acoustic wave element.