FIXING METAL FOR CHIP SCALE PACKAGE,申请号JP20010035062-传众专利搜索

FIXING METAL FOR CHIP SCALE PACKAGE

申请公布号：JP2002246723(A)

申请号：JP20010035062

申请日期：2001.02.13

申请公布日期：2002.08.30

申请人：

SONY CORP

发明人：YAMADA TAKASHI

分类号：H05K7/12;H05K1/18;(IPC1-7):H05K1/18

主分类号：H05K7/12

摘要：PROBLEM TO BE SOLVED: To protect the solder joint of a chip scale package(CSP) against breakage and to prevent breakdown of the CSP. SOLUTION: A fixing metal 10 for a CSP comprises a member 11 for retaining the upper surface of the CSP mounted on a printed board, a guide part 12 having a screw hole 12a for screwing the retaining member 11 and guiding the retaining member 11, and a part 13 for fixing the guide part 12 to the printed board and touching the ground line thereof to discharge the static electricity. The retaining member 11 retains the upper surface of the CSP fixedly, to reduce thermal expansion and contraction thereof mechanically thus protecting the joint of the CSP against breakage; and furthermore, the fixing part 13 makes contact with the ground line of the printed board and discharges the static electricity generated in the CSP and prevents breakdown of the CSP.