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SYSTEM FOR PROCESSING OBJECT TO BE PROCESSED

申请公布号:JP2002076089(A)

申请号:JP20000253201

申请日期:2000.08.23

申请公布日期:2002.03.15

申请人:
TOKYO ELECTRON LTD

发明人:SAKATA KAZUNARI

分类号:C23C14/56;C23C16/44;H01L21/673;H01L21/677;H01L21/68;(IPC1-7):H01L21/68

主分类号:C23C14/56

摘要:PROBLEM TO BE SOLVED: To simplify structures of various mechanisms adjacent to an opening and contribute to space saving in a predetermined process for carrying in an object to be processed through the opening in a partition wall that separates a carrying area for an accommodating box from a carrying area for the object to be processed (an area for carrying a wafer). SOLUTION: A carrying area for the accommodating box 44 provides a carrying means 60 for a box on standby keeping the accommodating box 2 for the object to be processed on standby near the opening 28. The box 2 accommodates the next object W to be processed carried into the carrying area 46 for the processed object. Thus, the structures of various mechanisms adjacent to the opening 28 are simplified and space is saved in the predetermined process for carrying the object W through the opening 28 in the partition wall 26 that separates the area 44 from the area 46 (the area for carrying the wafer).

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