MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE,申请号JP20000255080-传众专利搜索

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

申请公布号：JP2002076198(A)

申请号：JP20000255080

申请日期：2000.08.25

申请公布日期：2002.03.15

申请人：

MATSUSHITA ELECTRIC IND CO LTD

发明人：SATO MOTOAKI

分类号：H01L23/28;H01L21/56;H01L25/065;H01L25/07;H01L25/18;(IPC1-7):H01L23/28

主分类号：H01L23/28

摘要：PROBLEM TO BE SOLVED: To solve the problem that a semiconductor chip is shifted in the thickness direction of a semiconductor device by the influence of the pressure of an injecting sealing resin and the semiconductor chip or a die pad part is exposed from a resin sealing face in the case that the semiconductor device laminating and mounting a plurality of the semiconductor chips is different in the size of the respective semiconductor chips. SOLUTION: A thermosetting paste resin 10 containing a filler 10 is applied on the rear face of the first semiconductor chip 3f, and since the rear face of the first semiconductor chip 3f and the surface of a resin sealing metal mold 11 are fixed by adhering the rear face of the first semiconductor chip 3f on the surface of the resin sealing metal mold 11, the first semiconductor chip 3f and the die pad part 2 are prevented from being shifted in the thickness direction of the semiconductor device without receiving the influence of pressure and injecting speed during the injection of the sealing resin in a resin sealing process.