PROCESS FOR ASSEMBLING ELECTRONICS USING MICROWAVE IRRADIATION,申请号CA19962222703-传众专利搜索

PROCESS FOR ASSEMBLING ELECTRONICS USING MICROWAVE IRRADIATION

申请公布号：CA2222703(C)

申请号：CA19962222703

申请日期：1996.06.27

申请公布日期：2002.02.12

申请人：

LAMBDA TECHNOLOGIES, INC.

发明人：GARARD, RICHARD S.;FATHI, ZAKARYAE;WEI, JIANGHUA

分类号：H05K3/32;H05B6/80;H05K3/30;H05K3/34;(IPC1-7):H05K13/04

主分类号：H05K3/32

摘要：The present invention provides a process for assembling electronics which allows for rapid heating and fast curing, and avoids subjecting the componen ts to potentially damaging cure conditions. The process includes applying conductive or non-conductive curable thermoplastic or thermosetting resins, having adhesive properties, to a surface of the substrate or electrical component or both. One or more electrical components may be mounted on the substrate using the adhesive properties of the resin. The resin is then subjected to variable frequency microwave irradiation selected to cure the resin without adversely affecting the substrate or electrical components.</S DOAB>