CURING COMPOSITION FOR PHOTOFORMING AND PRODUCT,申请号JP20000126588-传众专利搜索

CURING COMPOSITION FOR PHOTOFORMING AND PRODUCT

申请公布号：JP2001310918(A)

申请号：JP20000126588

申请日期：2000.04.26

申请公布日期：2001.11.06

申请人：

MITSUBISHI RAYON CO LTD;TEIJIN SEIKI CO LTD

发明人：FUKUSHIMA HIROSHI;NURISHI SEIJI;FUJIMOTO JUICHI;HAYAMA YASUSHI;TAMURA JUNICHI;HAGIWARA TSUNEO;OTAKE MAKOTO

分类号：C08J5/00;B29C67/00;C08F2/46;C08F290/06;(IPC1-7):C08F290/06

主分类号：C08J5/00

摘要：PROBLEM TO BE SOLVED: To provide a curing composition for photoforming capable of forming a product excellent in transparency and in mechanical properties such as a tensile strength, and which is excellent in handling because of the liquid with a low viscosity, can be cured for a short photocuring time and excellent in dimensional accuracy because of little volumetric shrinkage when photocuring. SOLUTION: (A) component: an amide hydroxy compound, a diol, an organic diisocyanated alkylester with a hydroxy group of (meta)acrylic acid are reacted and are obtained, an urethane (meta)acrylate compound having a radical polymerizable (meta)acryloyl oxy group, an amide group and an urethane group, (B) component: a kind at least of compounds with an ethylenic unsaturated bond capable of radical polymerization at least one in the molecule, (However, the urethane (meta)acrylate compound is excepted.) and (C): a photopolymerization initiator, are contained.