Circuit board and method for making the same,申请号US20010815564-传众专利搜索

Circuit board and method for making the same

申请公布号：US2001035299(A1)

申请号：US20010815564

申请日期：2001.03.23

申请公布日期：2001.11.01

申请人：

ACHARI ACHYUTA;GLOVATSKY ANDREW ZACHARY;BELKE ROBERT EDWARD;NATION BRENDA JOYCE;LI DELIN;GOENKA LAKHI N;PARUCHURI MOHAN R;GORDON ROBERT JOSEPH;KRAUTHEIM THOMAS BERND

发明人：ACHARI ACHYUTA;GLOVATSKY ANDREW ZACHARY;BELKE ROBERT EDWARD;NATION BRENDA JOYCE;LI DELIN;GOENKA LAKHI N;PARUCHURI MOHAN R;GORDON ROBERT JOSEPH;KRAUTHEIM THOMAS BERND

分类号：H05K3/00;H05K3/06;H05K3/40;H05K3/42;H05K3/44;H05K3/46;(IPC1-7):H05K1/03

主分类号：H05K3/00

摘要：A method for making a multi-layer circuit board 116 having apertures 96, 98 which may be selectively and electrically isolated from electrically grounded member 46 and further having selectively formed air bridges and/or crossover members 104 which are structurally supported by material 112. Each of the apertures 96, 98 selectively receives electrically conductive material 114.