Thinner composition and methods and systems for using the thinner composition,申请号US19990338798-传众专利搜索

Thinner composition and methods and systems for using the thinner composition

申请公布号：US6261970(B1)

申请号：US19990338798

申请日期：1999.06.23

申请公布日期：2001.07.17

申请人：

SAMSUNG ELECTRONICS CO., LTD.

发明人：JEON MI-SOOK

分类号：H01L21/306;G03F7/42;H01L21/311;(IPC1-7):H01L21/302;H01L21/461

主分类号：H01L21/306

摘要：Thinner compositions for effectively removing photoresist. The thinner compositions may be used in reworking a semiconductor substrate or in rinsing semiconductor devices. The thinner composition may be a mixture of n-butyl acetate (n-BA) and ethyl acetate (EA), a mixture of n-butyl acetate (n-BA) and methyl methoxy propionate (MMP), or a mixture of n-butyl acetate (n-BA) and methyl ethyl ketone (MEK).