Resin sealing method for a semiconductor device

申请公布号：US6261501(B1)

申请号：US19990235403

申请日期：1999.01.22

申请公布日期：2001.07.17

申请人：

APIC YAMADA CORPORATION

发明人：MIYAGAWA TSUTOMU;AOKI KUNIHIRO;KODAMA MASAHIRO;MIYAJIMA FUMIO

分类号：B29C33/68;B29C45/02;B29C45/14;B29L31/34;H01L21/56;H01L21/60;(IPC1-7):B29C45/02;B29C70/74

主分类号：B29C33/68

摘要：A resin sealing method for sealing a joining portion between a semiconductor chip 12 and a substrate 10 by filling a underfilled portion of a molded piece 40 in which a semiconductor chip is mounted on a substrate with solder bumps studded therebetween with sealing resin 14 by a transfer molding process, the method being characterized in that when the molded piece 40 is clamped with a mold of a transfer molding machine, the perimeter of the underfilled portion, except the end of a gate continuous to the underfilled portion, is closed with a release film 20, and in a state that the perimeter of the underfilled portion is closed, the sealing resin 14 having been supplied to a pot 42 provided in the mold is fed under pressure to the underfilled portion, to thereby fill the underfilled portion.

PRODUCTION OF MODIFIED FLUORORESIN

PRODUCTION OF MODIFIED WHEAT FLOUR

SEAWEED HARVESTING METHOD IN LONGLINE-TYPE SEAWEED CULTURE AND SYSTEM THEREOF

DIAPHRAGM CONTROL DEVICE FOR CAMERA

SYNCHRONIZING DETECTION BASE MEASURING DEVICE

CERAMIC BOARD PROCESSING JIG

SEMICONDUCTOR LASER AND MANUFACTURE THEREOF

MANUFACTURE OF COMPOUND SEMICONDUCTOR INTEGRATED CIRCUIT CAPACITOR

DRY-ETCHING METHOD

VIDEO CAMERA

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

AUTOMATIC FIRE ALARM DEVICE

FILE MAINTENANCE SYSTEM WHEN SYSTEM IS DOWN

PRESSURE SENSITIVE ADHESIVE SHEET

SELF-ADVANCING RECORDER

BLANKET FOR OFFSET PRINTING AND MANUFACTURE THEREOF

METHOD AND DEVICE FOR FORMING COMBINED PLATE OF PALLET, ETC.

SUPPORTER FOR FORMING COMBINED PLATE OF PALLET, ETC.

VARIABLE VORTEX FORMING APPARATUS

POSITION DETECTING APPARATUS