FBGA PACKAGE INCLUDING BEAM LEAD WITH CONTAINING COUPLE BONDING PART,申请号KR19990055695-传众专利搜索

FBGA PACKAGE INCLUDING BEAM LEAD WITH CONTAINING COUPLE BONDING PART

申请公布号：KR20010054744(A)

申请号：KR19990055695

申请日期：1999.12.08

申请公布日期：2001.07.02

申请人：

SAMSUNG ELECTRONICS CO., LTD.

发明人：CHOI, GI WON;SONG, YEONG HUI

分类号：H01L23/02;(IPC1-7):H01L23/02

主分类号：H01L23/02

摘要：PURPOSE: An FBGA(Fine pitch Ball Grid Array) package including beam lead with containing couple bonding part id provided to prevent badness such as electrical disconnection due to a damage of a beam lead. CONSTITUTION: An FBGA(Fine pitch Ball Grid Array) package(200) is composed of a semiconductor chip(110), a carbon polymer(120), a tape for FBGA(150), and an external connection terminal(160) such as a solder ball. Bonding pads(112) are formed on the active surface of semiconductor chip(110), and the carbon polymer(120) is doped. The FBGA(150) tape is attached on the carbon polymer(120). The FBGA tape(150) consists of a polyimide film(130) and beam leads(140). An open aperture(134) is made in the polyimide film(130) for loading a solder ball(160), and a window(132) is built in the beam leads(140) to expose a couple bonding part(142). The couple bonding part(142) has two bonding leads. One bonding lead(147) is directly bonded with the bonding pads(112), and the other additional bonding lead(148) is connected with the edges of bonding lead(147). The couple bonding part is molded using an encapsulant(170) after bonding the bonding lead(147) on the bonding pads(112).