GRID ARRAY ASSEMBLY AND METHOD OF MAKING,申请号EP19970921223-传众专利搜索

GRID ARRAY ASSEMBLY AND METHOD OF MAKING

申请公布号：EP0908076(B1)

申请号：EP19970921223

申请日期：1997.04.23

申请公布日期：2001.06.13

申请人：

AMKOR TECHNOLOGY, INC.

发明人：FREYMAN, BRUCE, J.;BRIAR, JOHN;MAXCY, JACK, C.

分类号：H01L23/28;H01L21/48;H01L21/56;H01L21/66;H01L21/68;H01L23/12;H01L23/31;H01L23/498;H01L23/50;H05K1/18

主分类号：H01L23/28

摘要：A grid array assembly is provided employing a thin copper or steel carrier frame having apertures extending longitudinally of the frame. A series of semi-flexible substrate printed circuit boards are mounted in seriatim to peripheral edges of the apertures, the circuit boards including bonding pads and metallization on a first surface and conductive vias in the circuit boards extending to a second opposite surface containing a contact pad array. The carrier strip with the mounted circuit boards are passed to a station where an IC die is mounted on the board first surface, wire bonds are placed from the die to the bonding pads and the assembly encapsulated using a portion of the carrier strip as a mold gate to form a package body. Subsequently each grid array assembly is singulated from the carrier strip.