Reflow soldering self-aligning fixture,申请号US20000533410-传众专利搜索

Reflow soldering self-aligning fixture

申请公布号：US6241141(B1)

申请号：US20000533410

申请日期：2000.03.22

申请公布日期：2001.06.05

申请人：

UNITEK

发明人：AL-NABULSI TALAL M.

分类号：B23K1/00;B23K3/047;B23K3/08;H05K3/34;H05K3/36;(IPC1-7):B23K37/04;B23Q1/25

主分类号：B23K1/00

摘要：An improvement in a reflow soldering apparatus for bonding a connector element such as flexible circuitry or a pin type input/output (I/O) connector to a printed circuit board (PCB) is disclosed wherein a fixture tray included in the apparatus automatically aligns or self levels itself with the heating bars, or thermodes, of the apparatus. The fixture tray includes a body for supporting the connector/PCB assembly and cylindrical rods extending from the body. The rods are rotatably supported in corresponding grooves on the surface of the fixture tray table. As a thermode is pressed onto the connector/PCB assembly, the fixture tray rotates about its axis of rotation until the work area is aligned with the thermode. In a sandwich type soldering application including a pair of thermodes for simultaneously soldering opposite sides of a connector/PCB assembly, the fixture tray rests on an upper plate of a tray table supported by resilient means such as springs. Pressing an upper thermode onto the upper work surface of the connector/PCB assembly causes the work surface to rotate into alignment with the thermodes, and further causes the upper plate to descend until the bottom work surface of the connector/PCB assembly contacts the lower thermode prior to initiation of a reflow soldering cycle.