Sandwich plate for lining walls and ceilings with integrated heating or cooling circuits has capillary mat of thin pipes integrated in heating circuit and embedded by layer of heat-conductive paste in insulating layer
申请公布号:DE10019315(A1)
申请号:DE2000119315
申请日期:2000.04.19
申请公布日期:2001.05.31
发明人:WEIGEL, JUERGEN;CHAHED, BECHIR
分类号:E04C2/52;E04F13/08;F24D3/16;(IPC1-7):E04C2/52;E04B1/76;E04F15/02
主分类号:E04C2/52
摘要:The sandwich plate has a capillary mat formed from several thin pipes (5) integrated in the heating or cooling circuit and embedded by a layer (6) of heat-conductive paste in the insulating layer (2) which is made of a hard material. The insulating layer is connected to the cover layer (8) with a flat surface. The insulating layer is made from foamed plastics, foamed glass, plaster board or the like and the cover layer is made from glass particles, fibre reinforced plastics or the like.