CHEMICAL MACHINE GRINDING DEVICE AND MANUFACTURE OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE USING THE SAME,申请号JP19990138694-传众专利搜索

CHEMICAL MACHINE GRINDING DEVICE AND MANUFACTURE OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE USING THE SAME

申请公布号：JP2000326215(A)

申请号：JP19990138694

申请日期：1999.05.19

申请公布日期：2000.11.28

申请人：

HITACHI LTD

发明人：SAITO TOSHIYA;TAGUMA YUICHIRO;TAKADA YORIO

分类号：B24B37/04;B24B37/30;B24B37/32;H01L21/304

主分类号：B24B37/04

摘要：PROBLEM TO BE SOLVED: To average the load to be added to a semiconductor wafer with respect to a chemical machine grinding device provided with a pressure head comprising a retainer ring having cuts inside thereof, by forming the retainer ring with a lower part retaining the semiconductor wafer and an upper part provided with cuts. SOLUTION: A semiconductor wafer 1 as a material to be ground is retained by a pressure head 2, a wafer surface is ground by an abrasive pad 4 attached to a rotary grinding surface plate 3, and the slurry 7 is supplied from a supply nozzle 6 during the grinding. A surface of the abrasive pad 4 is cut by a dresser 5 to reproduce its performance. The pressure head consists of a wafer carrier 8, a retainer ring 9 and an elastic thin film (PET sheet) 10, and the retainer ring 9 consists of a lower part 9a mounted for preventing the removement of the semiconductor wafer 1 during the grinding, and an upper part 9a provided with cuts capable of receiving the bending of the PET sheet 10.