PACKAGE FOR HOUSING SEMICONDUCTOR ELEMENT,申请号JP19990063669-传众专利搜索

PACKAGE FOR HOUSING SEMICONDUCTOR ELEMENT

申请公布号：JP2000260896(A)

申请号：JP19990063669

申请日期：1999.03.10

申请公布日期：2000.09.22

申请人：

KYOCERA CORP

发明人：TOGOSHI MASAHIRO;SHIBAHARA TOSHIKAZU

分类号：H01L23/12;(IPC1-7):H01L23/12

主分类号：H01L23/12

摘要：<p>PROBLEM TO BE SOLVED: To prevent generation of electric short-circuits between adjacent wiring layers. SOLUTION: This package is constituted of an insulating substrate 1, having a recessed part 1a for housing a semiconductor element 3 having a step difference 1b on an inner wall face, a wiring layer 5 whose one edge is exposed to the difference in step difference 1b and whose other edge is derived via the inside part of the insulating substrate 1 to the outer surface with which the electrodes of the semiconductor element 3 are connected, and a cover body 2 jointed to the insulating substrate 1 for covering the recessed part 1a. In this case, the thickness of the region exposed to the step difference 1b and the thickness of the region positioned inside the insulating substrate 1 of the wiring layer 5 are respectively set in the range of 10μm-15μm and 20μm-30μm.</p>