ELECTROSTATIC CHUCK OF HIGH THERMAL CONDUCTIVITY, USABLE IN VACUUM, AND EASY TO DEFORM,申请号JP20000066473-传众专利搜索

ELECTROSTATIC CHUCK OF HIGH THERMAL CONDUCTIVITY, USABLE IN VACUUM, AND EASY TO DEFORM

申请公布号：JP2000260856(A)

申请号：JP20000066473

申请日期：2000.03.10

申请公布日期：2000.09.22

申请人：

NIKON CORP

发明人：MICHAEL SOGAADO

分类号：G03F7/20;H01L21/683;H02N13/00;(IPC1-7):H01L21/68

主分类号：G03F7/20

摘要：<p>PROBLEM TO BE SOLVED: To allow use in vacuum while, comprising high thermal conductivity, not affected by dust particles, by fitting a membrane to a support member with a frame and beam, forming a hollow region, and connecting the hollow region to a cooling gas supply source through a gas piping hole. SOLUTION: A membrane 108 of an electrostatic chuck comprises a beam 104 and a frame 102, and the membrane 108 is combined to an upper part layer 112 of a support member 110 with the beam 104 and the frame 102. A hollow region 107 is formed between an upper part layer 112 and the membrane 108. A gas piping hole 106 penetrates a part of the support member 110. The upper layer part 112 is made of a wafer while, with the wafer being thin, a bottom surface is finely worked to provide a small groove 114. The groove 114 raises efficiency for transferring a heat to a cooling liquid which fills the hollow part 116 of the support member 110. Thus, use in vacuum is allowed while immune to the effect of dust particles and deformation of a holding member, suppressing temperature rise with the holding member.</p>