LEAD-FREE SOLDER ALLOY AND ITS MANUFACTURE,申请号JP19990018343-传众专利搜索

LEAD-FREE SOLDER ALLOY AND ITS MANUFACTURE

申请公布号：JP2000210788(A)

申请号：JP19990018343

申请日期：1999.01.27

申请公布日期：2000.08.02

申请人：

MATSUSHITA ELECTRONICS INDUSTRY CORP

发明人：KIBE MAKI;INADA MASAKI

分类号：B23K35/26;B23K35/40;C22C1/02;C22C13/00;(IPC1-7):B23K35/26

主分类号：B23K35/26

摘要：PROBLEM TO BE SOLVED: To provide a solder material having a melting temperature nearly equal to that of a Pb-Sn solder which is mainly composed of Sn replacing Pb being a harmful substance in a conventional Pb-Sn solder and does not contain Pb or the other harmful substance. SOLUTION: In a method for manufacturing a lead-free solder alloy incorporating three component eutectic consisting of Sn, Zn and Mg2Sn, a mixed metal 1 of a lead-free solder material consisting of Sn, Zn and Mg or Sn, Zn and Mg2Sn and a mixture consisting of KCl and LiCl or the like are put into an alumina crucible 2 to be treated with heat and the mixed metal 1 is molten in the molten liquid 3 of the above mixture which does not react with metal.