COMPOSITE FOIL FORMED BY AN ALUMINUM AND A COPPER,申请号KR19990032251-传众专利搜索

COMPOSITE FOIL FORMED BY AN ALUMINUM AND A COPPER

申请公布号：KR20000017134(A)

申请号：KR19990032251

申请日期：1999.08.06

申请公布日期：2000.03.25

申请人：

MITSUI MINING & SMELTING CO., LTD.

发明人：YOSIOKAJWUNSI;OBATASINICHI;DOBASIMAKOTO;GATAOKADAKASI

分类号：H05K3/38;B32B15/08;C25D1/04;C25D5/10;C25D7/06;H05K1/09;H05K3/00;H05K3/02;H05K3/46;(IPC1-7):H05K3/00

主分类号：H05K3/38

摘要：<p>PURPOSE: A composite foil is provided to has a uniform bond strength which is capable of removing a carrier easily after accumulating while being suitable for preventing a division of the carrier and an ultra-thin copper foil at accumulating. CONSTITUTION: The composite foil comprises a protection layer which is wired between an aluminum carrier layer and an ultra-thin copper foil. The protection layer includes a zinc which sufficiently provides an appropriate bond strength between the aluminum carrier layer and the ultra-thin copper foil and has an interpenetrates sufficient for protecting the ultra-thin copper foil after the aluminum carrier layer is separated. The bond strength between the ultra-thin copper foil and the aluminum carrier layer is about 1 to 50 gf/cm.</p>