ROOM TEMPERATURE CURING COMPOSITION,申请号JP19980207867-传众专利搜索

ROOM TEMPERATURE CURING COMPOSITION

申请公布号：JP2000038503(A)

申请号：JP19980207867

申请日期：1998.07.23

申请公布日期：2000.02.08

申请人：

GE TOSHIBA SILICONES CO LTD

发明人：ONO KAZUHISA

分类号：C08K3/36;C08K9/06;C08L71/02;(IPC1-7):C08L71/02

主分类号：C08K3/36

摘要：PROBLEM TO BE SOLVED: To obtain a composition excellent in storage stability and flowability in an uncured state and having good adhesion, curing properties and mechanical properties by compounding (A) a silicon-functional group-containing silyl or siloxanyl terminated polyether, a curing catalyst and a fumed silica with the surface treated with an organosilicon compound. SOLUTION: A polyether portion of component (A) preferably comprises an oxyalkylene group of the general formula: R1-O- (wherein R1 is a 2-4C alkylene group). A fumed silica is a spherical fine powder silica obtained by oxidative decomposition of silicon tetrachloride and the like and is surface- treated with an organosilicon compound to impart hydrophobicity by silylation of silanol groups present on the surface and to increase the bulk density. Hexamethyldisilazane is especially preferred as the organosilicon compound. The fumed silicon preferably has a BET specific surface area of 120-200 m2/g and a bulk density of 120-200 g/l.