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Verfahren zum Umhüllen eines elektronischen Bauteils mit härtbarem Kunststoff

申请公布号:DE69508815(T2)

申请号:DE19956008815T

申请日期:1995.01.25

申请公布日期:1999.11.11

申请人:
"3P" LICENSING B.V., ZEVENAAR

发明人:PAS, IRENEUS JOHANNES THEODORUS MARIA

分类号:B29C33/12;B29C33/68;B29C39/10;B29C39/22;B29C45/14;B29C45/26;B29C45/46;B29K105/20;B29L31/34;H01L21/56;H01L23/28;(IPC1-7):H01L21/56

主分类号:B29C33/12

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