ELECTRONIC COMPONENT MOUNTING METHOD,申请号JP19970345077-传众专利搜索

ELECTRONIC COMPONENT MOUNTING METHOD

申请公布号：JPH11177299(A)

申请号：JP19970345077

申请日期：1997.12.15

申请公布日期：1999.07.02

申请人：

MATSUSHITA ELECTRIC IND CO LTD

发明人：YAMAMOTO MINORU;HIRAI WATARU;SAKURAI KUNIO;HAMAZAKI KURAYASU;MAKINO YOICHI

分类号：B23P21/00;H05K1/02;H05K13/04;H05K13/08

主分类号：B23P21/00

摘要：PROBLEM TO BE SOLVED: To prevent a failure board from being sent to a subsequent process by detecting the position of a board prior to electronic component mounting and that after the electronic component mounting, comparing the detected positions, and detecting the mounting deviation clue to the positional deviation of the board during mounting operation. SOLUTION: Prior to mounting a component 3, the positional deviation quantities of the actual position 9b of a recognition mark 9 from its correct position 9a, i.e., ΔXa and ΔYa, are measured. Then, the component 3 is mounted by correcting the position by the measured positional deviation quantities, and the components 3 are successively mounted at the actual positions of an electrode 10. When mounting operation to a board 4 is completed, the position of the recognition mark 9 is remeasured, is compared with the position 9b measured prior to the mounting operation, and when the positional deviation exceeds a fixed quantity that causes mounting failure, a control part is instructed to give the alarm to the operator to inform the operator that the workpiece is a failure board. Thus, even when a failure board is manufactured by not mounting the component at the correct position due to the positional deviation of the board during mounting operation, the failure board is prevented from being sent to the subsequent process.