STRUCTURE AND METHOD OF MOUNTING ELECTRONIC COMPONENT WITH BUMP

申请公布号：JPH11163049(A)

申请号：JP19970327759

申请日期：1997.11.28

申请公布日期：1999.06.18

申请人：

MATSUSHITA ELECTRIC IND CO LTD

发明人：MAEDA KEN;YOSHINAGA SEIICHI

分类号：H01L23/28;H01L21/56;H01L21/60;H01L23/12;H05K3/28;H05K3/34;(IPC1-7):H01L21/60

主分类号：H01L23/28

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