INTERPOSER FOR STACK MODULE AND STACK MODULE,申请号JP19970298909-传众专利搜索

INTERPOSER FOR STACK MODULE AND STACK MODULE

申请公布号：JPH11135711(A)

申请号：JP19970298909

申请日期：1997.10.30

申请公布日期：1999.05.21

申请人：

NEC CORP

发明人：KYOGOKU YOSHITAKA;OKUBO KAZUHIKO

分类号：H01L25/00;H01L23/498;H01L25/065;H01L25/07;H01L25/18;H05K1/11;H05K1/14;(IPC1-7):H01L25/00

主分类号：H01L25/00

摘要：<p>PROBLEM TO BE SOLVED: To provide a stack module and an interposer with improved productivity. SOLUTION: Interposers 1 and 2 have electrode pads B1, B2, C1, and C2 for chip selection being arranged adjacent, and the electrode pads B1 and C1 for one first chip selection are connected to the chip selection terminals of semiconductor chips 3 and 4. The other electrode pads B2 and C2 for chip selection are connected to opposite-surface side electrodes B1' and C1' which are placed at the opposite-surface side of the adjacent electrodes B1 and C1 for chip selection in the direction of an electrode for the first chip selection. The opposite-surface side electrode B1' is connected to the electrode C1 for chip selection of the interposer which faces the electrode B1' by a conductive bump 6.</p>