TEMPERATURE CONTROL DEVICE, SUBSTRATE PROCESSING DEVICE, AND, COATING AND DEVELOPMENT PROCESSING DEVICE,申请号JP19970224304-传众专利搜索

TEMPERATURE CONTROL DEVICE, SUBSTRATE PROCESSING DEVICE, AND, COATING AND DEVELOPMENT PROCESSING DEVICE

申请公布号：JPH1154600(A)

申请号：JP19970224304

申请日期：1997.08.06

申请公布日期：1999.02.26

申请人：

TOKYO ELECTRON LTD

发明人：TAKEKUMA TAKASHI;DEGUCHI MASATOSHI;SATAKE MASAKI

分类号：H01L21/683;G03F7/20;H01L21/027;(IPC1-7):H01L21/68

主分类号：H01L21/683

摘要：<p>PROBLEM TO BE SOLVED: To control temperature of two mountings with one circulatory system of heat conductive medium. SOLUTION: Two cooling water flowing pipes 33 and 43 in each mounting 32 and 42 corresponding to two cooling processing devices CPI and CP2 are connected together by a connection pipe 22 in series. The cooling water supplied from a supplying device 21 circulates a forward pipe 23, the flowing pipe 33, the connection pipe 22, and a returning pipe 24. A temperature control mechanism 28 controlling the cooling water is controlled by the temperature of the cooling water detected by a temperature sensor 26 installed in the connection pipe 22.</p>