DEVICE AND METHOD FOR EXPOSING PERIPHERY AND METHOD FOR MANUFACTURING DEVICE
申请公布号:JPH10308350(A)
申请号:JP19970132963
申请日期:1997.05.08
申请公布日期:1998.11.17
发明人:KAWASHIMA HARUNA;SASAKI AKIRA
分类号:G03F7/38;H01L21/027;(IPC1-7):H01L21/027
主分类号:G03F7/38
摘要:PROBLEM TO BE SOLVED: To compensate for deterioration of resist sensitivity due to side rinsing without increasing a gray zone. SOLUTION: A device for exposing periphery irradiates a part of a peripheral part of a resist-applied wafer 1, having an almost circular form, with exposure light in a form of a specified irradiation region 18, and by relatively rotating a wafer around its center axis under the condition, the resist of the peripheral part of the wafer is exposed in annular manner. In this case, the form of the irradiation region has a side almost along the inner side of the annular form, and also has a form in which the quantity of the exposure light increases from the side toward the center of the annular form.