BALL GRID ARRAY SEMICONDUCTOR PACKAGE WITH HEAT SINK,申请号JP19960182798-传众专利搜索

BALL GRID ARRAY SEMICONDUCTOR PACKAGE WITH HEAT SINK

申请公布号：JPH10308466(A)

申请号：JP19960182798

申请日期：1996.06.24

申请公布日期：1998.11.17

申请人：

ANAM IND CO INC

发明人：SHIM IL KWON;HEO YOUNG WOOK

分类号：H01L23/12;H01L23/04;H01L23/31;H01L23/36;H01L23/367;H01L23/498

主分类号：H01L23/12

摘要：PROBLEM TO BE SOLVED: To realize a semiconductor package which is capable of discharging heat released from a semiconductor chip directly from it through the intermediary of a heat sink of high thermal conductivity, by a method wherein the heat sink is fixed to a die paddle extension surrounding a sealing part. SOLUTION: A part of the periphery of a die paddle 21 of copper or copper alloy where a semiconductor chip 30 is mounted is extended up to the peripheral edge of a package to serve as a die paddle extension 22. A heat sink 10 attached onto the upside of the die paddle extension 22 is exposed to the outside, so that heat released from the semiconductor chip 30 is discharged out through the heat sink 10 via the die paddle 21 located under the semiconductor chip 30 and the extension 22 extended to the peripheral edge of the package. Therefore, heat, is effectively dissipated into outside air through all the exposed surface of the heat sink 10, which is effective to the improvement of the package in both properties and service life.