PROCESS OF APPLYING METALLIC BINDING LAYER FOR CERAMIC HEAT-INSULATING LAYERS TO METALLIC BUILDING ELEMENTS,申请号CZ19960003468-传众专利搜索

PROCESS OF APPLYING METALLIC BINDING LAYER FOR CERAMIC HEAT-INSULATING LAYERS TO METALLIC BUILDING ELEMENTS

申请公布号：CZ9603468(A3)

申请号：CZ19960003468

申请日期：1996.11.26

申请公布日期：1997.08.13

申请人：

ABB RESEARCH LTD

发明人：FRIED REINHARD

分类号：C23C24/10;C23C4/02;C23C4/18;C23C24/08;C23C26/00;C23C28/00;(IPC1-7):C23C24/00;C04B37/02

主分类号：C23C24/10

摘要：A method of applying a metallic bonding layer for thermally sprayed ceramic heat insulating layers (6) on metallic components involves (a) applying a binder onto the degreased and oxide-free metallic surface of the substrate material (2); (b) applying metallic bonding powder (4) uniformly onto the binder; (c) applying solder powder (5), of smaller particle size than the bonding powder (4), uniformly onto the binder; and (d) drying the binder and heat treating to effect soldering. In an alternative method, an oxidation and corrosion resistant layer is produced on the cleaned metallic surface by gas-shielded plasma spraying prior to step (a), the bonding powder is a coarse powder having the same composition as this oxidation and corrosion resistant layer, step (c) is omitted and step (d) comprises drying the binder and then heat treating (solution annealing) to form a sintered bond between the metallic component and the oxidation and corrosion resistant layer and between the oxidation and corrosion resistant layer and the bonding powder. Also claimed are metallic bonding layers produced by the above methods.