THICK FILM CONDUCTOR PASTE COMPOSITION FOR ALUMINUM NITRIDE SUBSTRATE,申请号JP19950229635-传众专利搜索

THICK FILM CONDUCTOR PASTE COMPOSITION FOR ALUMINUM NITRIDE SUBSTRATE

申请公布号：JPH0952785(A)

申请号：JP19950229635

申请日期：1995.08.16

申请公布日期：1997.02.25

申请人：

DU PONT KK

发明人：OKAMOTO YOSHINORI

分类号：C03C8/02;C04B41/50;C04B41/51;C04B41/86;C04B41/87;C04B41/88;H01L23/498;H05K1/09;(IPC1-7):C04B41/88

主分类号：C03C8/02

摘要：PROBLEM TO BE SOLVED: To easily obtain a thick film conductor paste compsn. capable of screen printing on an AlN substrate by dispersing electric conductor powder and a boride in an org. solvent. SOLUTION: Electric conductor powder and a boride are dispersed in an org. solvent such as terpineol by satisfactorily kneading them with a three-roll milling machine, etc., to obtain the objective thick film conductor paste compsn. capable of screen printing on an AlN substrate. Powder of a metal such as Ag or Pd or powder of an alloy of such metals is used as the electric conductor powder and fine powder having about 0.5-5μm particle diameter is preferably used. A binary compd. of boron and a metallic element or a multielement compd. contg. boron is used as the boride and TiB2 , ZrB2 , HfB2 , UB2 , NbB2 , TaB2 , CrB2 or MoB2 is preferably used.