Device for handling wafers,申请号US19940352654-传众专利搜索

Device for handling wafers

申请公布号：US5595412(A)

申请号：US19940352654

申请日期：1994.12.09

申请公布日期：1997.01.21

申请人：

SHIN-ETSU HANDOTAI CO., LTD.

发明人：KUDO, HIDEO;UCHIYAMA, ISAO

分类号：B08B11/04;B08B3/04;B65G49/07;H01L21/304;H01L21/677;H01L21/687;(IPC1-7):B66C1/42

主分类号：B08B11/04

摘要：The present invention provides a device for handling wafers with every group of more than one that is built in a cassette-less automatic wafer cleaning apparatus, wherein the group of wafers are washed at a time which does not require very high accuracy in positioning the wafers and may accommodate the wafers of any different diameters, the device for handling wafers comprising: external hollow shafts and internal shafts inserted and freely slidable within the inside of the external hollow shafts; a drive mechanism, wherein each pair of the external hollow shafts and the internal shafts are movable in their respective opposed directions by the same distances with a timing belt and a drive motor for driving the timing belt; a pair of handling members respectively held fast at pairs of ends side by side of each pair of the external hollow shafts and the internal shafts; and a plurality of supporting structures holding the wafers provided on the respective opposed surfaces of handling members.