SEMICONDUCTOR PACKAGE,申请号JP19950075834-传众专利搜索

SEMICONDUCTOR PACKAGE

申请公布号：JPH08274432(A)

申请号：JP19950075834

申请日期：1995.03.31

申请公布日期：1996.10.18

申请人：

HITACHI COMMUN SYST INC

发明人：KONNO SHIGERU

分类号：H05K1/05;H01L25/04;H01L25/18;(IPC1-7):H05K1/05

主分类号：H05K1/05

摘要：<p>PURPOSE: To suppress heat generation and promote high-density mounting of a printed wiring board. CONSTITUTION: When one side terminal part 3b of a semiconductor package 1 is connected to a metal core printed wiring board 11 and a terminal part 3a of the other side is connected to a socket 13, heat generating from the package 1 is radiated by the wiring board 11, thereby the wiring board 11 performs a radiation equal to a radiation fin so as to suppress a temperature rise of the package 1. Further, various kinds of surface mount parts 14 can be mounted on the wiring board 11, and the number of the parts on the multilayer printed wiring board 10 can be reduced corresponding to the above mounted parts so as to allow mounting of other electronic parts thus to surely raise the parts mounting density.</p>