MOLD FOR SEMICONDUCTOR PACKAGE MOLDING,申请号JP19950095525-传众专利搜索

MOLD FOR SEMICONDUCTOR PACKAGE MOLDING

申请公布号：JPH0851125(A)

申请号：JP19950095525

申请日期：1995.04.20

申请公布日期：1996.02.20

申请人：

KANBI KINKEI:KK

发明人：KAKU ROKEN

分类号：B29C45/26;B29C45/02;B29C45/14;B29L31/34;H01L21/56;(IPC1-7):H01L21/56

主分类号：B29C45/26

摘要：PURPOSE: To obtain a mold for semiconductor package in which a resin supply port can be arranged selectively upward or downward with respect to an upper or a bottom mold by moving a port fixing block selectively depending on the operating position of the plunger of a mold press. CONSTITUTION: The mold for semiconductor package comprises an upper mold 1 being secured to the upper side of a mold press and a bottom mold 2 being secured to a moving plate. The upper mold 1 is arranged with an upper cavity block 12 and selectively arranged with an upper center block 5 or a port fixing block 6. The bottom mold 2 is arranged with a lower cavity block 16 and selectively arranged with the upper center block 5 or the port fixing block 6. The port fixing block 6 is arranged with a port 4. When a plunger 7 is directed downward, the port fixing block 6 is arranged on the upper mold 1 otherwise it is arranged on the bottom mold 2.