DIELECTRIC BOARD MODULE,申请号JP19940117863-传众专利搜索

DIELECTRIC BOARD MODULE

申请公布号：JPH07326866(A)

申请号：JP19940117863

申请日期：1994.05.31

申请公布日期：1995.12.12

申请人：

MURATA MFG CO LTD

发明人：TOKI HIROSHI;SUZAKI HIDESHI;YAMANAKA TOSHIAKI

分类号：H05K1/02;H01L23/12;H05K1/00;H05K3/46;(IPC1-7):H05K3/46

主分类号：H05K1/02

摘要：<p>PURPOSE:To provide a dielectric board module which is high enough in heat dissipating properties and strength. CONSTITUTION:A dielectric board module 100 is formed through such a manner that dielectric board layers 1, 3, 5, and 7 and GND layers 2, 4, and 6 are laminated, wiring patterns 1i, 3i, and 5i are buried in the dielectric board layers 1, 3, and 5, a wiring pattern 1s is formed on the surface of the dielectric board layer 1, an active device chip 8 is mounted thereon, and two heat transfer members 9 extending from the active device chip 8 to the GND layer 2 are buried in the dielectric board layer 1. Heat released from the active device chip 8 is transmitted to the GND layer 2 through the intermediary of the heat transfer members 9, then transferred to the dielectric board 1 from the GND layer 2, and then dissipated into the air from the dielectric board 1. By this setup, a dielectric board module of this constitution is enhanced enough in heat dissipation capacity, so that an active device can be prevented from deteriorating in characteristics. No holes are bored in a dielectric board, so that the board is kept high in mechanical strength.</p>