Semiconductor package and method.
申请公布号:EP0671766(A1)
申请号:EP19950301179
申请日期:1995.02.23
申请公布日期:1995.09.13
发明人:TEMPLE, VICTOR ALBERT KEITH
分类号:H01L23/15;H01L23/373;H01L23/433;(IPC1-7):H01L23/31;H01L25/07;H01L23/14
主分类号:H01L23/15
摘要:<p>A package for one or more semiconductor devices has an electrically insulative and thermally conductive base (32) on a thermally conductive support (34). The semiconductor devices may be enclosed in an encapsulant (36) and are electrically contacted through leads (56,58,62) that extend through the encapsulant. <IMAGE></p>
HIGH PRESSURE GENERATING DEVICE
PROCESS OF FORMING PAPER CONTAINING ADDITAMENTS AND POLYAMIDE - EPICHLOROHYDRIN RESIN
POLYPHENYLENE ETHERS STABILIZED WITH COMBINATIONS OF NITROGEN-CONTAINING STABILIZERS
NEGATIVE ELECTRODE AND ELECTROCHEMICAL BATTERY CONTAINING SAME
ELECTROCHEMICAL CELL WITH TIN OXIDE ELECTRODE
METHOD OF PLATING GOLD FILMS ONTO OXIDE-FREE SILICON SUBSTRATES
Einstell- und Regelschaltung fuer Kathodenstrahlroehren
Klemmhalterung fuer Farbstoffbehaelter an Druckmaschinen
E-Ebenen-Hohlleiterzirkulator mit drei Anschluessen
Anordnung zur galvanisch getrennten,kontaktlosen Messung des absoluten Wertes von Impedanzen
Bohreinrichtung,insbesondere zum Tieflochbohren fuer Bohr- und Drehmaschinen
Photographische Halogensilbermaterialien
Photographisches Material zur Aufzeichnung ionisierender Strahlen