CIRCUIT BOARD,申请号JP19930335233-传众专利搜索

CIRCUIT BOARD

申请公布号：JPH07202356(A)

申请号：JP19930335233

申请日期：1993.12.28

申请公布日期：1995.08.04

申请人：

TOYOTA MOTOR CORP;KYOCERA CORP

发明人：YAMAMOTO KEIJI;HOSOI YOSHIHIRO

分类号：H01L21/60;H05K1/00;H05K1/03;H05K1/09;H05K3/24;H05K3/40;H05K3/46

主分类号：H01L21/60

摘要：PURPOSE:To provide a circuit board which can join a bonding wire and a circuit conductor firmly and quickly when directly mounting an active element such as a semiconductor element on the circuit board without any package. CONSTITUTION:A wiring conductor 2 consisting of high melt-point metal made of tungsten, molybdenum, manganese, etc., is formed inside and on the surface of an insulation board 1 such as ceramic and further a circuit conductor 4 consisting of copper is deposited so that the surface of the exposed wiring conductor 2 is covered. A bonding pad 2a is formed at a part which is exposed on the outer surface of the insulation board 1, a covering layer 5 which mainly consists of nickel with a Vickers hardness of 600 or larger is deposited on the surface of the bonding pad 2a, and a bonding wire which is connected from the area on the covering layer 5 to each electrode of the semiconductor element A.