Chip-carrying card mfr. - involves chip recess prodn. by forming blind hole and then embossing

申请公布号：DE4241482(A1)

申请号：DE19924241482

申请日期：1992.12.09

申请公布日期：1994.06.16

申请人：

SIEMENS AG, 80333 MUENCHEN

发明人：KETZER, GEORG, 82008 UNTERHACHING

分类号：G06K19/077

主分类号：G06K19/077

摘要：In the mfr. of IC cards (e.g. cheque, credit, telephone and identify cards), involving fixing of an IC chip in a recess (M) formed in a plastics card, the novelty is that the recess (M) is formed by (i) producing a blind hole (S) in the card (K); and (ii) forming the recess (M) by means of an embossing punch (P), the excess plastics being displaced into the blind hole (S). Also claimed is the appts. used for carrying out the above process. ADVANTAGE - The process has a short prodn. time (e.g. 2.4 secs. per card compared with 6 secs. or more for prior art processes) and solves the problem of material displaced during the embossing operation.

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