Heat sink for electrical circuit components,申请号US19920987692-传众专利搜索

Heat sink for electrical circuit components

申请公布号：US5316077(A)

申请号：US19920987692

申请日期：1992.12.09

申请公布日期：1994.05.31

申请人：

EATON CORPORATION

发明人：REICHARD, JEFFREY A.

分类号：F28F3/12;H01L23/473;(IPC1-7):H01L23/473

主分类号：F28F3/12

摘要：A heat sink for electrical circuit components includes a chill plate which is formed by a front plate and a back plate. The front and back plates are interconnected and cooperate to define passages for liquid coolant. Cooling fins extend from the back plate and are exposed to the atmosphere to conduct heat from the back plate. A pump is mounted on the chill plate and induces a flow of the cooling medium through passages between the front and back plates. An expansion chamber is also disposed between the front and back plates and holds gas which is compressible by the liquid cooling medium to accommodate expansion of the liquid cooling medium.