QUAD-FLAT-PACKAGE TYPE IC,申请号JP19920289714-传众专利搜索

QUAD-FLAT-PACKAGE TYPE IC

申请公布号：JPH06140538(A)

申请号：JP19920289714

申请日期：1992.10.28

申请公布日期：1994.05.20

申请人：

NEC CORP

发明人：TANDA TETSUO

分类号：H01L23/36;H01L23/50;H05K1/02;H05K3/30;H05K3/34;(IPC1-7):H01L23/36

主分类号：H01L23/36

摘要：<p>PURPOSE:To obtain a QFP type IC without the restrictions with operating speed and power by attaching a heat radiating sheet at the bottom of the body of a package. CONSTITUTION:This IC is constituted of a package body 101, wherein an IC chip 101c is sealed, a plurality of leads 102, which are guided out of the outer surface of the package body 101, and a heat radiating sheet 103, which is bonded to the bottom surface of the package body 101. Liquid epoxy resin bonding agent is applied on the heat radiating sheet 103, and the heat radiating sheet 103 is stuck to the bottom surface of the body of the package, heated for 5 to 20 minutes at 100-150 deg.C and bonded. The heat radiating sheet 103 is formed of epoxy resin, which is melted and hardened at 200-250 deg.C. Therefore, the package body 101 and a printed board 104 are linked by solder mounting. Thus, heat can be dissipated from the bottom surface of the package main body to the printed board 104 through the heat radiating sheet 103, and the high- power, high-speed type IC chip can be mounted.</p>