Packaging for an electronic circuit board

申请公布号：US5280411(A)

申请号：US19930059817

申请日期：1993.05.10

申请公布日期：1994.01.18

申请人：

SOUTHWEST RESEARCH INSTITUTE

发明人：DIRKS, GREGORY J.;MULLER, MARK V.

分类号：H05K7/14;(IPC1-7):H05K7/20

主分类号：H05K7/14

摘要：A packaging for conventional printed circuit boards for protecting them from both thermal and mechanical stress. Heat conducting rails are attached to the edges of the card, and heat conducting leads used to connect heat generating components on the card to the rails. A support plate provides a rigid outer surface for the bottom of the card, with a shock absorbing layer sandwiched between the support plate and the bottom surface of the card. A heat conductive coating over the top surface of the card and its components acts as an additional heat sink.

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