Film-type electrical resistor combination,申请号US19920863834-传众专利搜索

Film-type electrical resistor combination

申请公布号：US5252944(A)

申请号：US19920863834

申请日期：1992.04.06

申请公布日期：1993.10.12

申请人：

CADDOCK ELECTRONICS, INC.

发明人：CADDOCK, JR., RICHARD B.

分类号：H01C1/034;H01C1/084;(IPC1-7):H01C1/034

主分类号：H01C1/034

摘要：The film-type electrical power resistor includes a flat chip of aluminum oxide, having a resistive film screen-printed onto one of its sides. Leads are bonded to that side and electrically connected to the film, the leads being such that the chip may be cantilevered by the leads in a mold cavity before introduction of synthetic resin into the cavity, and with the lower chip surface spaced above the bottom cavity wall. A molded body is molded in the cavity to fully encapsulate the chip, film, and inner ends of the leads, there being no mold cup around the molded body. The molded body is formed of high thermal-conductivity thermosetting synthetic resin. Provided through the body is a bolthole for clamping of the resistor to an external chassis or heatsink. The space between the bottom surface of the chip and the flat bottom surface of the molded body is a heat-sinking volume formed of the high thermal-conductivity resin; and the bottom surface of such volume of resin is the bottom surface of the resistor. The stated volume does not contain any metal that is either in an electric circuit, or projects outwardly relative to the edges of the chip.