Apparatus for interlayer planarization of semiconductor material.

申请公布号：EP0555660(A2)

申请号：EP19930100667

申请日期：1993.01.18

申请公布日期：1993.08.18

申请人：

WESTECH, INC.;RODEL, INC.

发明人：HYDE,THOMAS C.;ROBERTS,JOHN V.H.

分类号：B24B13/01;B24B37/22;B24D13/14;H01L21/304

主分类号：B24B13/01

摘要：<p>A pad for planarizing the surface of a semiconductor wafer. The pad includes at least two layers. One layer has an hydrostatic modulus which is different from the hydrostatic modulus of the other pad. <IMAGE></p>

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