ABS moulding compounds with improved yield stress,申请号US19920936069-传众专利搜索

ABS moulding compounds with improved yield stress

申请公布号：US5210135(A)

申请号：US19920936069

申请日期：1992.08.26

申请公布日期：1993.05.11

申请人：

BAYER AKTIENGESELLSCHAFT

发明人：EICHENAUER, HERBERT;PISCHTSCHAN, ALFRED;OTT, KARL-HEINZ

分类号：C08L51/04

主分类号：C08L51/04

摘要：Thermoplastic molding compounds, containing A) 5-95 weight % of a thermoplastic homo-, co- or terpolymer of styrene, alpha-methylstyrene, ring-substituted styrene, methyl methacrylate, acrylonitrile, methacrylonitrile, maleic anhydride, N-substituted maleimide, vinyl acetate or mixtures thereof, B) 5-95 weight % of a graft polymer of B.1) 5-90 parts by weight of styrene, alpha-methylstyrene, ring-substituted styrene, methyl methacrylate, acrylonitrile, methacrylonitrile, maleic anhydride, N-substituted maleimide, vinyl acetate or mixtures thereof on B.2) 95-10 parts by weight of a rubber with a glass transition temperature </=10 DEG C. and C) 0.1-5 parts by weight per 100 parts by weight A+B of a grafted product of resin-forming monomers on an ethylene-propylene-diene terpolymer rubber with a rubber content of 20-60 weight %.