FORMATION METHOD FOR THICK-FILM PATTERN

申请公布号：JPH04367215(A)

申请号：JP19910168807

申请日期：1991.06.13

申请公布日期：1992.12.18

申请人：

FUTABA CORP

发明人：YAMAURA TATSUO;ITO SHIGEO

分类号：G03F1/76;G03F7/26;G03F7/40;H01J9/02;H01J9/20;H01J9/24;H01L21/027

主分类号：G03F1/76

摘要：<p>PURPOSE:To provide a method wherein the deformation such as the slack or the like of a protruding pattern is not caused and a protruding part whose aspect ratio is high is formed on a substrate with high accuracy. CONSTITUTION:The formation method of a thick-film pattern is composed of the steps of forming a positive-type photosensitive layer 2 on a substrate 1; forming a mask pattern 7 on the surface of the photosensitive layer 2; spraying a developer to remove the inessential photosensitive layer while irradiating the substrate 1 with ultraviolet rays; baking and fixing a filler 10 filled into the removed part; and removing the filler 10.</p>

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