ECR PLASMA CVD APPARATUS,申请号JP19910004809-传众专利搜索

ECR PLASMA CVD APPARATUS

申请公布号：JPH04236446(A)

申请号：JP19910004809

申请日期：1991.01.21

申请公布日期：1992.08.25

申请人：

FUJI ELECTRIC CO LTD

发明人：NAGAO YASUAKI

分类号：H01L21/205;H01L21/31;H01L21/68

主分类号：H01L21/205

摘要：<p>PURPOSE:To arrange that a wafer is always received normally by using an air robot by a method wherein the central part of a saucer arranged inside a load-lock chamber is formed to be a recess in a mortar shape and the diameter of the bottom face of a mortar is formed to be nearly equal to that of the wafer. CONSTITUTION:A mortar-shaped recess 37 is formed in the central part of a thick disk composed of an aluminum material. The shape of the recess is formed as a slope at 60 deg. with reference to the horizontal. The diameter of the bottom face of the recess is formed to be nearly equal to that of a wafer. When this saucer is arranged, the wafer is always settled horizontally on the bottom face of the mortar-shaped recess of the saucer even when the wafer is dislocated in the horizontal direction on a hand at the tip part of a pantograph-system arm. It is possible to eliminate that an air robot fails to take the wafer or breaks it.</p>