HEAT SINK,申请号JP19900416512-传众专利搜索

HEAT SINK

申请公布号：JPH04230064(A)

申请号：JP19900416512

申请日期：1990.12.27

申请公布日期：1992.08.19

申请人：

AICHI STEEL WORKS LTD

发明人：KOBAYASHI TOSHIHITO;TAKAI SATOMI

分类号：H01L23/373

主分类号：H01L23/373

摘要：PURPOSE:To omit bonding pads and the soldering process of the pads, to give the function of a ceramic substrate to a heat sink and to contrive a reduction in cost by a method wherein part of the heat sink surface on which a power element is mounted is covered with an Al film and an electrical insulating layer is formed on the opposite surface to the power element mounting surface. CONSTITUTION:An Al film 2 is formed on part of the upper part of a heat sink 1 made of a material of a high heat conductivity by a CVD method and an electrical insulating layer 4 is formed on the opposite surface to a power element mounting side of the sink 1. For example, an Mo plate is plated with Ni, is bonded to an Al plate subjected to metallized work with a silver solder, is cut and molded, a soldering fillet is set on a tray 7 in such a way that the side of the Mo plate plated with Ni is faced downward and an Al film is made to deposit from the lower part of the tray by an ion plating. A bonding wire 9 made of aluminium is subjected to ultrasonic bonding on the Al covered part 2 and a power element 3 is soldered to the part of the Ni-plated surface which is not covered with the Al film.