A semiconductor device comprising two integrated circuit packages.,申请号EP19910309879-传众专利搜索

A semiconductor device comprising two integrated circuit packages.

申请公布号：EP0484062(A1)

申请号：EP19910309879

申请日期：1991.10.25

申请公布日期：1992.05.06

申请人：

MITSUBISHI DENKI KABUSHIKI KAISHA

发明人：UEMURA, SYUNITI;MURASAWA, YASUHIRO

分类号：H01L23/50;H01L23/495;H01L23/52;H01L25/10;H05K1/18

主分类号：H01L23/50

摘要：<p>A semiconductor device includes a package substrate (5), a first IC package (1a) having external lead terminals (2) which are downwardly bent with respect to a plane surface of the package and a second IC package (1b) having external lead terminals which are upwardly bent with respect to a plane surface of the package. These packages are provided on one surface of the package substrate and arranged in parallel with each other. One or more pairs of the external lead terminals of the first and second IC packages, which are facing to each other and to be electrically connected with each other, are arranged on the same mount pads (6) provided on the package substrate. Therefore, wires for connecting those lead terminals can be dispensed with and the other external lead terminals can be connected by simply drawing around wires without providing through holes. In addition, no positional deviation between the two packages occurs and no solder bridge of the leads owing to a complicated soldering occurs. <IMAGE></p>