AQUEOUS ADHESIVE COMPOSITION

申请公布号：JPH03172379(A)

申请号：JP19890312430

申请日期：1989.11.30

申请公布日期：1991.07.25

申请人：

SEKISUI CHEM CO LTD

发明人：MURAYAMA YUKIHIKO;NISHINAKA KOICHI;NAKAJIMA JUNICHIRO

分类号：C08L75/04;C08L75/00;C09J175/00;C09J175/04

主分类号：C08L75/04

MANUFACTURE OF SEMICONDUCTOR DEVICE

MANUFACTURE OF SEMICONDUCTOR DEVICE

CALENDAR-ORIENTED PILL DISPENSER

METHOD OF MAKING AND APPARATUS FOR COMPOSITE PISTONS

MACHINE FOR LIFTING TUBERS

POLYAMIDE-BASE MIXED RESIN COMPOSITION AND MELT EXTRUSION MOLDINGS THEREOF

ADAPTIVE PREFERENTIAL FLOW CONTROL FOR PACKET SWITCHING SYSTEM

CONSTANT TEMPERATURE HEATING VALUE MEASUREMENT APPARATUS

APPARATUS AND METHOD FOR INCREASING WEAR LIFE OF CERAMIC TOOLS

SURGICAL APPARATUS FOR RADIARY KERATOTOMY

CONTROL OF TELECOMMUNICATION SWITCHING SYSTEMS

BATTERY SWITCH

MAGNETICALLY ATTRACTABLE DEVELOPER MATERIAL TRANSPORT APPARATUS

VEHICLE IMMOBILISATION DEVICE

Process for soldering semiconductor components

VORRICHTUNG ZUM AUFREIHEN ELEKTRISCHER BAUELEMENTE ZU EINEM GURT

KUPPLUNG FUER DEN ANTRIEB EINES KREUZTISCHES

Direct evaporative-cooling system for power semiconductors

Heat-insulating render

Method and arrangement for the serial transmission of the digital measurement values of a measurement transducer