Semiconductor integrated circuit device having mirror image circuit bars bonded on opposite sides of a lead frame,申请号US19880213463-传众专利搜索

Semiconductor integrated circuit device having mirror image circuit bars bonded on opposite sides of a lead frame

申请公布号：US5014112(A)

申请号：US19880213463

申请日期：1988.06.29

申请公布日期：1991.05.07

申请人：

TEXAS INSTRUMENTS INCORPORATED

发明人：GELSOMINI, TITO

分类号：H01L23/495

主分类号：H01L23/495

摘要：A pair of like, semiconductor integrated circuit bars, such as DRAMS, have second level bonding pads formed over their active surfaces in mirror images of one another. The bars then become bonded to opposite sides of frame bonding pads of a lead frame to double the capacity of a normally encapsulated integrated circuit. The normal bar bonding pads of the circuit bars are arranged identical to one another, and a patterned and etched second level of metal forms second level lands over the bar bonding pads, the mirror image second level bonding pads and second level leads connecting corresponding second level lands to second level pads. A pair of 256K DRAMS can be connected either 256Kx2 or 512Kx1 by use of dummy second level pads for DATA-IN/OUT and ROW ADDRESS STROBE connection.