THICK FILM CIRCUIT SUBSTRATE,申请号JP19890182019-传众专利搜索

THICK FILM CIRCUIT SUBSTRATE

申请公布号：JPH0346392(A)

申请号：JP19890182019

申请日期：1989.07.14

申请公布日期：1991.02.27

申请人：

NEC CORP

发明人：CHIKAMORI SHIGEO

分类号：H01C17/22;H01C7/00;H05K1/16

主分类号：H01C17/22

摘要：<p>PURPOSE:To enable easy formation of a resistor of a desired resistance value by providing grooves to a shortcircuit conductor at a plurality of positions for different shortcircuit positions and by adjusting a pattern of the shortcircuit conductor using the groove. CONSTITUTION:A desired circuit is formed of a conductor 2 of a desired pattern on a surface of an insulating substrate 1 and a resistor 3 is formed in a desired pattern. A part of the resistor 3 is bent to form an approximately U-shape and a conductor 5 is formed to shortcircuit the resistor 3. The shortcircuit conductor 5 is provided with grooves at a plurality of positions as marks for use to adjust shortcircuit positions of the resistance 3. A resistance value of a resistor formed first is measured to select a groove 6 which realizes a desired value. A part of the shortcircuit conductor 5 is masked from a position of the groove 6 when the next resistor is formed. A desired resistance value is acquired in this way.</p>