PRINTED CIRCUIT BOARD METHOD

申请公布号：KR900005308(B1)

申请号：KR19870015679

申请日期：1987.12.31

申请公布日期：1990.07.27

申请人：

CHUNG POONG PRODUCTS CO., LTD.

发明人：MOON DUK-MAN

分类号：H05K3/00;H05K1/09;H05K1/11;H05K3/24;H05K3/28;H05K3/34;H05K3/46;(IPC1-7):H05K3/00

主分类号：H05K3/00

摘要：The printed circuit board is produced by the stages of silkscreening a circuit board with a conductive resin on a substrate made of thermosetting resin, thermoplastic resin or ceramic, drying and hardening at 120-300 deg. C for 4-10 minutes, immersing the substrate for 20-40 minutes in a plating solution of no electrolysis to make 10-20 microns metal layer on the circuit of the substrate, coating the substrate with a nonconductive material, and punching the components inserting part of the substarte.

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